Technical items and Tips

EMC.

• Component data.
   
• Current Loop Area and Emission
• Current path in ground plane (PDF)
• Ground - a path for current to flow. (Henry Ott) (PDF)
• How to measure characteristic impedance (PDF)
• Impedance and characteristic impedance. (Eric Bogatin)
• Differential impedance - What's the difference? (Douglas Brooks Ultracad)
• Low Voltage Differential Signaling, 4th Ed. (LVDS) - (Texas Instruments)
• Transmission Line Rapidesigner. (TI / National Semi. Ap. Note 905) (PDF)
• LVDS Application and Data Handbook
• Printed Circuit Board (PCB) Test Methodology. (Intel 29817901)
• Some Magnetic terms (PDF)
• Measuring Parasitic Capacitance and Inductance Using TDR.  David Dascher, HP
• IC supply voltage bounce with variation of external bypass capacitor (Roy Ediss PDF)
• Groundbounce with IC package and PCB (Roy Ediss PDF)
• Chart of plane wave electric field strength verses distance. (PDF)
• Field Power Density calculation for electric field strength units of V/m  or  dBuV/m. (PDF)

Signal Integrity

• Signal Intergrity Characterization Techniques (Keysight PDF)
   
• Signal Integrity issues & interconnect characterization. (PDF)
   
• Time Domain Reflectometry (TDR) measurements for Signal Integrity. (PDF)
   
• Characteristic impedance of flexible foil cable track arrangements. (PDF)
   
• 75 ohm BNC connector and cable characterization with TDR (PDF)
   

•  The effect of guardtraces; HyperLinx simulation of crosstalk using TDR  (PDF's)
       (1) Initial capacitive crosstalk between 5 thou aggressor, 5 thou victim, 15 thou gap.
       (2) Capacitive crosstalk 5 thou aggressor, 5 thou guard trace, 5 thou victim,  5 thou gaps
       (3) Initial inductive crosstalk between 5 thou aggressor, 5 thou victim, 15 thou gap.
       (4) Inductive crosstalk 5 thou aggressor, 5 thou guard trace, 5 thou victim, with 5 thou gaps.
   

RF Engineering.